Wet device for ceramic substrates
It is a wet processing device for ceramic substrates. It is used in the photo-etching of thermal printer heads and the plating process of resistor substrates.
This is a compact manufacturing device designed for small substrates. We introduce a photo-etching line for forming electrode patterns on thermal printer head (TPH) substrates, as well as a plating device for chip resistor substrates. Based on our manufacturing achievements, we also present standard equipment specifications in our catalog. Essentially, these are custom-made devices tailored to customer requirements, allowing for flexible responses according to the materials used and processing steps. Please feel free to contact us.
- Company：進和工業 本社工場
- Price：5 million yen-10 million yen
